Monday, January 11, 2010

Sensor: MEMS integrated with IC tends to spread the high-end(A)

Automotive electronic control systems “normal operation” is inseparable from the sensor escort sony vgp bps9, through the sensor can be a variety, such as pressure, flow, position, height, distance, speed, speed, temperature and signal transmission to the power system, security system control unit, to achieve the purpose of driving a normal car. Is because of the need various signals, and thus a wide range of automotive sensors, currently on an ordinary family car is about to install only a few dozen to nearly one hundred sensors, while the number of sensors on the high-end cars can reach more than 200 only. Over the years, used to measure pressure, temperature and speed sensors measure has been the protagonist of automotive electronics, but the auto upgrade feature makes the sensor has gone beyond the sensor signals back to the control unit of such a level, the sensor’s “intelligent” already pretty VGP-AC19V13 clear.

Sensors and IC integration is the key

The intelligent sensors to improve the inevitable choice is IC and sensor integration, which has become the industry’s focus of attention. At present a lot of such products as clay Freescale, Infineon, NXP, and many other vendors charge for tire pressure sensor chip on the integrated sensor and IC. Other applications include pressure sensor chip, magnetic sensor chips are integrated.

Infineon sensing and control, said John McGowan, director, TPMS sensors requirement Sony VGP-BPS2A is rugged, long life and reasonable cost. Infineon developed a TPMS sensor is used for data processing and signal modulation CMOS ASIC with a piezoelectric pressure measuring element on a common lead framework. He also introduced, by processing and sensor integrated together, to ensure temperature compensation, self-tuning capabilities and failure mode detection accuracy. In terms of cost control, on a single chip can integrate multiple functions and features as well as the production area to focus on. And this intelligent sensor to allow more small CPU freed computing from the data so that it can be faster processing.

Billion in order to get Europe on a joint venture between VGP-BPS9 automotive sensor technology, Mori, director of Tektronix, said Pang Chuan, IC and sensor integration to reduce the size of the benefit is to reduce interference. He also said that an integrated approach in two ways: One is the SoC, high integration, but due to the sensor and IC processes are different, more difficult to achieve relatively large. The other is the SOP, is easier to achieve, mainly Sony VGP-BPS8 packaging clearance.